| abstract |
(57) [Summary] [Structure] In a low thermal expansion resin composition for pressure molding, which contains an epoxy resin, a curing agent, a curing accelerator and a filler as essential components, the resin component comprising the epoxy resin and the curing agent is 150 The viscosity at 3 ° C. is 3 poises or less, 95% or more of the filler is a substantially spherical powder having a particle size of 0.1 to 100 μm and an average particle size of 2 to 20 μm, and This filler is compounded in the range of 75 to 92.5 vol% with respect to the entire composition, The resin composition has a minimum melt viscosity of 3000 poise or less in a pressure molding process and a thermal expansion coefficient of 1.0 × 10 5 / ° C. or less to 0.3 × 10 5 / ° C. or less after being pressed. Be in range. [Effect] The resin composition of the present invention has good moldability, and a molded product having a thermal expansion coefficient as small as that of an inorganic material can be easily obtained. |