| abstract |
(57) [Summary] [Structure] A bismaleimide compound represented by the general formula [1] (wherein R represents hydrogen, an alkyl group or halogen, and n represents an integer of 1 to 4), and a general formula [ 2] (In the formula, C 9 F 17 groups are perfluorononenyl groups having one double bond, X represents a divalent organic group containing an ester bond or an ether bond. The thermosetting resin composition containing the biscyanamide compound represented by these. [Effect] The resin composition has excellent moldability and adhesiveness, the cured product has excellent heat resistance, and has a small relative dielectric constant of 3 or less. [Chemical 12] |