http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05140272-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3f548ca15b9b5748f1afd80e3d1636ec |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate | 1991-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff424f360474c454bca0bbea4639dd9a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ec1a351f2cd16b838880fddfcdf64bd |
| publicationDate | 1993-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H05140272-A |
| titleOfInvention | Thermosetting resin composition and molded parts thereof |
| abstract | (57) [Summary] [Structure] The present invention provides (A) epoxy resin, (B) N- Hydroxyphenylmaleimide or N-hydroxyphenylmaleimide / vinyl compound copolymer and (C) an inorganic filler are essential components, and the above-mentioned (B) N-hydroxyphenylmaleimides is added to the entire composition. A thermosetting resin composition containing 0.1 to 50% by weight and a thermosetting resin molded part formed by molding the thermosetting resin composition. EFFECTS OF THE INVENTION According to the present invention, it is excellent in heat resistance, mechanical / electrical characteristics and crack resistance, and has a good balance of characteristics, and is suitable for electronic / electrical parts, automobile parts and the like. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006307062-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4674112-B2 |
| priorityDate | 1991-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.