| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_52a65b677bbedbe7bf090dd556a7cc43 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31681
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2379-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0358
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-51 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
1991-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99916a6889121403be76b3b12740c488
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_546fcc85a42ab91830f088afd33e3f54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c070dfea7c1405761f59ca3322fbc594
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ed47a8dadf50df6cccf0229ab3f90b2 |
| publicationDate |
1993-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H0513902-A |
| titleOfInvention |
Flexible printed circuit board and manufacturing method thereof |
| abstract |
(57) [Summary] [Structure] In a flexible printed circuit board obtained by directly applying a polyimide precursor on a metal conductor foil and then drying and heating to form a polyimide film, the polyimide film has two or more layers. A flexible printed circuit board which is made of laminated polyimide and has a coefficient of linear thermal expansion of at least one polyimide layer subsequent to the second layer which is larger than that of the polyimide of the first layer in contact with the metal conductor foil. [Effect] There is provided a flexible printed wiring board that does not curl immediately after curing and does not curl even after circuit formation by etching. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101467179-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4841103-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009528933-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8066891-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102059056-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019135367-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011508685-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008531334-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100820221-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8221842-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005277036-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8426029-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007512988-A |
| priorityDate |
1990-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |