http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05138791-A

Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B5-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B17-04
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B38-00
filingDate 1991-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6cb1c0eb676890b4e874bb6bd8b58c7
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publicationDate 1993-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05138791-A
titleOfInvention Laminated board manufacturing method
abstract (57) [Summary] [Structure] The tensile strength in the 45 ° direction is 2 with respect to the warp and weft. 0kg / 25mm or less and the weight ratio of warp / weft is 0.8 The glass cloth having the above-mentioned 1.2 or less is preferably subjected to a fiber opening treatment so that the air permeability is 3 cc / cm 2 / sec or less, and a thermosetting resin varnish such as an epoxy resin is impregnated and dried to obtain a prepreg. A predetermined number of these are laminated and formed. [Effect] Since the dimensional stability is excellent, the degree of freedom in designing the printed wiring board is expanded, and there is no need to perform scaling for dimension correction between each process separately in vertical and horizontal directions. Most suitable for manufacturing printed wiring boards.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0873860-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-1075440-C
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priorityDate 1991-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 21.