| abstract |
(57) [Summary] [Structure] At least a part of the acid anhydride group in the copolymer mainly composed of indene and maleic anhydride is esterified with unsaturated alcohol. The resulting novel photosensitive resin. [Effect] The photosensitive resin of the present invention has high heat resistance, and when used alone or as a composition with other components, it can be used as a solder resist, an etching resist, a plating resist, and a pattern forming material at the time of manufacturing a semiconductor element. It is useful. |