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filingDate 1991-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1fb678a15f2a96ce797fc4172e23090c
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publicationDate 1993-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05129699-A
titleOfInvention Laser device and manufacturing method thereof
abstract (57) [Summary] [Purpose] Optical precision adjustment is not required, mass production is facilitated, and cost reduction is achieved. [Configuration] A solid-state laser material 1 is excited by a semiconductor laser 7, and the excited light is converted by a wavelength conversion material 3 into a wavelength of ½. The other surface of the plate-shaped solid-state laser material 1 having the plane reflection mirror 2 formed on one surface thereof is in contact with the other surface of the plate-shaped wavelength conversion material 3 having the reflection mirror 4 formed on one surface thereof. Then, the other surface of the solid-state laser material 1 and the wavelength conversion material 3 The curing shrinkable adhesive 5 is filled in the concave groove 6 provided on the outer side of any one of the laser oscillation regions on the other surface. At this time, it is desirable that the contact surface between the other surfaces of the solid-state laser material 1 and the wavelength conversion material 3 is inclined within a range of 1 to 10 degrees with respect to the reflection surfaces of the plane reflection mirrors 2 and 4.
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priorityDate 1991-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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