http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05129432-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-02
filingDate 1991-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf729fdc42b181d2006d3305a49bb496
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29052e403cf5a5d2c213d2970a2204e7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0988d87c0f583f97c2af4841b3888033
publicationDate 1993-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05129432-A
titleOfInvention Adhesive sheet for semiconductor wafer dicing
abstract (57) [Summary] [Object] The present invention is for semiconductor wafer dicing in which there is no generation of chlorine ions during the dicing of a semiconductor wafer and no detachment and scattering of element chips of the wafer chip, and the subsequent picking up of the wafer chip is easy. Provide an adhesive sheet. [Structure] In a pressure-sensitive adhesive sheet for semiconductor wafer dicing, a laminated film comprising at least two layers having an internal plasticized polyvinyl chloride film and a polyolefin film as a layer constituent material is used as a surface substrate for transmitting ultraviolet rays. An ultraviolet-curable pressure-sensitive adhesive layer whose adhesive strength is reduced by irradiation with ultraviolet rays is formed on the surface of the polyolefin film.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002338911-A
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priorityDate 1991-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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