http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05121578-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-08
filingDate 1992-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9bca97ce8f7bd1306714d5a2f8ae863a
publicationDate 1993-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05121578-A
titleOfInvention Composite substrate with high thermal conductivity and low alpha particle emission for electronic packages
abstract (57) Abstract: A microelectronic circuit package including integrated circuits mounted on a circuit card, having electrical connections for signal, power and ground therebetween, said circuits comprising a perfluorocarbon polymer. And filled from a filled polymer dielectric containing a synthetic inorganic filler having a low alpha particle emission rate, a high coefficient of heat transfer and a low coefficient of thermal expansion dispersed throughout the polymer. The polymer is characterized by having a lower coefficient of thermal expansion than the polymer and a higher coefficient of heat transfer than the polymer. This is one or more polyfluorocarbon sheets coated with electrically and thermally conductive filler particle composites coated with a polyfluorocarbon resin contained in a solvent, heated to drive off the solvent and heat the dried sheet. It is manufactured by fusing the filler particles coated with the polyfluorocarbon resin and the sheet. It is particularly advantageous for use as a circuit package for a high storage density MOS storage chip.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8815725-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9181440-B2
priorityDate 1991-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419549582
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419578835
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419517688
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6339
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415776903
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8302
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID411556313
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6594
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID407774248
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419546607
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24547
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6369
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419523906
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14775
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID11638
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID83286
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID2779022
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8301
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419517738
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID410511377
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6393
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419521495
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559550

Total number of triples: 35.