http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05121356-A

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Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
filingDate 1991-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2052d4596d1306c756eb917598721d73
publicationDate 1993-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05121356-A
titleOfInvention Wiring formation method
abstract (57) [Abstract] [Purpose] To achieve high barrier properties and low resistance in contact parts having a barrier metal structure. [Structure] The contact hole 4 opened in the SiO 2 interlayer insulating film 3 is sequentially covered with a first Ti layer 5 and a TiN x layer 6, and then the wafer is exposed to an oxidizing atmosphere such as depressurized oxygen and oxygen plasma. Vacuum transfer and leave. By this oxidation treatment, thin TiO x is formed on the surface of the columnar crystal grains of the TiN x layer 6. As the Ny layer is formed, oxygen segregates at the grain boundaries, improving the barrier property. Since TiN x having a low resistance remains inside the crystal grains, the increase in resistivity is suppressed as a whole. Since the wafer is not exposed to the atmosphere in the middle of the process, it is possible to avoid adverse effects due to the adhesion of water to the wafer surface. Then the second Ti A layer 7 is formed to complete the barrier metal 8, Al-1% S The contact hole 4 is filled with the i layer 9.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6007684-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10927453-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100274748-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100396891-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6146998-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6150720-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5858184-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7384866-B2
priorityDate 1991-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419523291
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559362
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559477
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23963
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID977
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID93091

Total number of triples: 29.