| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
1991-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c09ddd536da8960210b8070cde840760 |
| publicationDate |
1993-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H051208-A |
| titleOfInvention |
Liquid epoxy resin molding material |
| abstract |
(57) [Abstract] [Purpose] Liquid epoxy resin molding materials for encapsulating and molding electrical and electronic parts require both substrate warpage and encapsulation workability, but conventional products can achieve both. I couldn't. [Structure] Particle size 0.5-3 microns, 4-7 microns, 1 By using a liquid epoxy resin molding material containing silica of 0 to 20 μm and 22 to 30 μm, both substrate warpage and sealing workability could be achieved. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100679490-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5719225-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9331657-B2 |
| priorityDate |
1991-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |