http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H051206-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1991-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a248e9ac1fda821c61ad943941740c5d |
| publicationDate | 1993-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H051206-A |
| titleOfInvention | Liquid epoxy resin molding material |
| abstract | (57) [Abstract] [Purpose] A liquid epoxy resin molding material for encapsulating and molding electrical and electronic components requires low stress, but high viscosity, reduced moisture resistance, and bleeding on the surface of the molded product. Was a problem. [Structure] By using a liquid epoxy resin molding material containing a reaction product composed of vinyl organopolysiloxane, hydrogenoorganopolysiloxane, and polyoxyalkylorganopolysiloxane, low stress, low viscosity, It is possible to improve the moisture resistance and prevent the occurrence of bleeding on the surface of the molded product. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9214270-B2 |
| priorityDate | 1991-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.