abstract |
(57) [Summary] [Purpose] In contact-type temperature measurement, the effects of the measurement environment and the surface state of the object to be measured are reduced to realize highly reliable temperature measurement with few measurement errors. [Structure] A thermal conductive cap 40 for contacting the back surface of the semiconductor wafer 12 is attached to the tip of the thermocouple 38. The heat conducting cap 42 is made of a material having a high heat conductivity such as silver, copper, brass or diamond, and is composed of a disc contact portion 40a, a socket portion 40c and a taper portion 40d. The disk contact portion 40a receives heat from the semiconductor wafer 12 on the entire upper surface thereof. The heat from the wafer 12 received by the disk contact portion 40a is concentrated and averaged by the taper portion 40d, and the temperature measuring junction of the thermocouple 38 is passed through the fixed (fixed) contact surface in the counterbore 40b. It is transmitted to the section 38a. The thermocouple 38 converts the temperature sensed by the temperature measuring contact portion 38a into a thermoelectromotive force and sends it as an electric signal to the temperature measuring circuit. |