| abstract |
(57) [Summary] [Structure] An acid component containing 4,4'-oxydiphthalic acid dianhydride (A mole) and another acid dianhydride component (B mole), and 1,3-bis (3 -Aminophenoxy) benzene C and an amine component containing another diamine component D mol, and at least one of 4,4'-oxydiphthalic dianhydride or 1,3-bis (3-aminophenoxy) benzene As an essential ingredient, (A + C) / (A + B + C + D) is 0.5 to 1.0, (A + B) / (C + D) is reacted in the range of 0.8 to 1.2, and at least 80% or more of the polyimide resin is imidized, and A highly heat-conductive film adhesive that can be thermocompression-bonded and is composed of a filler having a thermal conductivity of 5.0 [W / (m · K)] of 30 to 900 wt%. [Effect] Excellent heat resistance, good workability in thermocompression bonding at low temperature, low pressure, and short time, excellent adhesion to metals such as copper and silicon, ceramics, and solder melting not only at room temperature but at 260 ° C It is possible to obtain a film adhesive having sufficient adhesive strength even at a temperature and having excellent heat dissipation property. |