| abstract |
(57) [Summary] (Modified) [Purpose] A positive resist which has sufficient oxygen plasma resistance when used as an upper resist of a two-layer structure resist, and has excellent sensitivity and resolution. An organosilicon polymer that can be used for [Structure] The following formula (1): [Si 2 R 1 O 3 ] m [(R 2 ) 3 SiO 1/2 ] n (1) [wherein, m and n are positive integers, and m / n = 90/10 -10/90, R 1 R 2 may be the same or different, and represent C 1 -C 10 alkylene, represented by the following formula (2) and the like. (R 3 represents a lower alkyl group or an aryl group), a lower alkyl group or an aryl group, and at least 20% or more of R 2 is represented by the following formula (3) or the like. (R 3 is the same as defined above), and the weight average molecular weight is 1,000 to 5,0. A resist composition is formed so as to form an organosilicon polymer of 0,000, and further contains the organosilicon polymer, a certain dissolution inhibitor, an onium salt of an acid generator, and an organic solvent. |