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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G5-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G5-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
filingDate 1991-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c83a8e8ee50cf6a15e3b11f14f5a95a
publicationDate 1993-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05110231-A
titleOfInvention Cleaning method and cleaning device for printed wiring board
abstract (57) [Summary] [Purpose] Efficiently removes chlorine from post flux, which has an effect on the wettability of solder, from the printed wiring board after soldering. In a method of cleaning a printed wiring board 4 in which a component 3 is soldered using a post flux 2 containing a chlorine content 1, carbon black 17 is mixed with a cleaning liquid 16, The mixed cleaning liquid is bubbled to contact and clean the printed wiring board 4 after soldering. The cleaning liquid 16 is composed of a water-isopropanol-based mixed solution. Also, the cleaning device A cleaning liquid container 12 for storing a cleaning liquid 16 mixed with carbon black, and a foaming device (13, 15) provided in the cleaning liquid container 12 for foaming the cleaning liquid 16 are configured.
priorityDate 1991-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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