http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05110066-A

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filingDate 1991-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_362b58d06dc4301a9cd2199d0ad984b4
publicationDate 1993-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05110066-A
titleOfInvention Quantum wire structure manufacturing method
abstract (57) [Summary] [Objective] To provide a technique for manufacturing a fine quantum wire structure in a self-aligned manner with high accuracy. [Structure] After forming a first SiO 2 film, a first stripe groove 3 penetrating to the Inp substrate 1 is formed by anisotropic etching. After forming the AIN thin film 4 on the entire surface, the portions other than the side wall portions of the first stripe groove 3 are removed by anisotropic etching. Next, after filling the inside of the first stripe groove 3 having the AIN side wall with the second SiO 2 film 5, the upper end of the AIN side wall is exposed by anisotropic etching. Next, the AIN side wall is selectively removed with respect to the surrounding SiO 2 film to form the second stripe groove 6. The first Inp barrier layer 7 and InGaAs are formed in the second stripe groove 6. After the quantum well layer 8 and the second Inp barrier layer 9 are selectively grown, the SiO 2 film is removed, and finally, the Inp layer 10 is embedded to form an InGaAs quantum wire 11.
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priorityDate 1991-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 30.