http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05109910-A

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filingDate 1991-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b6d95fa156744907d0505b123b976df
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publicationDate 1993-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05109910-A
titleOfInvention Semiconductor device
abstract (57) [Summary] [Object] To provide a highly reliable semiconductor device in which moisture absorption in an interlayer insulating film is prevented and corrosion of a conductive layer and deterioration of an insulating function of an interlayer insulating film are suppressed. [Structure] In the interlayer insulating film 100, organic silane and oxygen are main components on a hygroscopic silicon oxide film 15 which is chemically vapor-deposited by thermal excitation from a gas phase containing organic silane and ozone as main components. Non-hygroscopic silicon oxide film 16 chemically vapor-deposited from the vapor phase by plasma excitation To a thickness of 200 nm or more. In the contact hole 19, A sidewall 17 made of a silicon oxide film having no hygroscopic property is formed by chemical vapor deposition of a gas phase containing organic silane and oxygen as main components by plasma excitation.
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Total number of triples: 27.