http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05105741-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00
filingDate 1991-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dcf4340e8e1ff85fa9d0b70f31ac4cc2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2581d58cced1f5e873497f64fee8de24
publicationDate 1993-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05105741-A
titleOfInvention Epoxy resin composition
abstract (57) [Summary] [Objective] It is an object to provide an epoxy resin composition having excellent heat resistance, flexibility and crack resistance. To achieve the above object, an epoxy resin composition is 100 parts of an epoxy resin, and a curing agent is represented by the following formula (1): (Wherein n is an integer of 1 to 5) or a phenol novolac resin represented by the following formula (3): 50 to 150 parts of polyallylphenol represented by the formula (n is an integer of 1 to 5) and the following formula (2) as a flexibility imparting agent: (In the formula, n is an integer of 50 to 100, and m is 1 to 10 5 to 50 parts by weight of maleimidopropyl polytetramethylsilphenylenedisiloxane / polydiethylenedioxysiloxane.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015117375-A
priorityDate 1991-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 27.