http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05102660-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 1991-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a7a9e8b92f6560aaadfc5d872279823 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a5248074f78fab05e75637a0ee91437 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18ce4d675b325f4c2ec709efb59a785b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bcf6b238d37c649264d80bd577effb93 |
| publicationDate | 1993-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H05102660-A |
| titleOfInvention | Multilayer wiring board and manufacturing method thereof |
| abstract | (57) [Summary] [Object] The present invention relates to a thin-film multilayer wiring board mounted at high density and a method for manufacturing the same, and is intended to shorten the manufacturing period, improve the yield, and improve the reliability. [Structure] A film-shaped insulator prepared in a formation pattern that can fill the space is filled in the wiring space of the skeleton structure. There are cases where the film-shaped insulator is cured after being heated and melted, and cases where it has already been treated so as not to melt. In the latter case, a gap between the wiring conductor and the film is filled with a solventless varnish to fix the adhesive by heating. Film filling and solventless varnish curing are performed with compression, transfer, injection, and other molds. Reduced pressure and increased pressure are also used. [Effect] The manufacturing time of the module and the computer can be shortened, the yield can be improved, and the reliability can be improved. Furthermore, the signal speed of the computer can be increased. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002226680-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002226681-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4670165-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002275359-A |
| priorityDate | 1991-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.