abstract |
PURPOSE: To enable prevention of oxidation of a probe card, prevention of temperature rise of DUT and removal of dust inside a wafer prober by providing a means to absorb from the outside, a means to shut a prober airtight from the air and filter to remove dust. n CONSTITUTION: After a transparent case 5 is opened and a wafer is provided to a wafer loader part 3, the transparent case 5 is closed and the wafer prober is shut off from outside air. Then, nitrogen gas is fed forcibly inside the wafer prober by a compressor 6 and evacuated through a filter 7. In the state, it is brought into contact with a probe card 2 and various tests are made. Since nitrogen gas is always fed through the filter 7 during operation of the wafer prober, oxygen is removed and oxidation of the probe card 2 is prevented. Furthermore, heat generation of DUT is prevented due to effects of air cooling. Since gas flows inside the wafer prober, it is possible to discharge dust generated inside to the outside and to remove it by the filter 7. n COPYRIGHT: (C)1992,JPO&Japio |