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filingDate 1990-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f81f35273bac5be196c52a5662415cd1
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publicationDate 1992-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H044257-A
titleOfInvention Resin composition and electronic part made thereof
abstract PURPOSE: To obtain a resin composition having excellent water-absorption characteristics, dimensional characteristics and reflow soldering resistance and suitable as a material for electronic part for surface-mounting by compounding a flame-retarded glass-fiber reinforced nylon 46 resin with a specific amount of a specific aliphatic polyamide resin. n CONSTITUTION: The objective composition is produced by compounding (A) 100 pts.wt. of nylon 46 resin with (B) 5-100 pts.wt. of an aliphatic polyamide resin having methylene groups and amide groups in the polymer main chain at a number ratio (methylene/amide) of ≥6 (e.g. nylon 12, nylon 11, nylon 612 or nylon 66/636 copolymer), (C) 2-100 pts.wt. of a brominated polystyrene, (D) 1-50 pts.wt. of a flame-retarding assistant (preferably antimony trioxide) and (E) 5-200 pts.wt. of glass fiber. n COPYRIGHT: (C)1992,JPO&Japio
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priorityDate 1990-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 32.