http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0437153-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5547f741b25666fc4ae5195cf71a979b |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate | 1990-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d10bc5e2208ef9089ed3116f18b958d |
| publicationDate | 1992-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0437153-A |
| titleOfInvention | Chip separation method |
| abstract | PURPOSE: To eliminate an expensive apparatus for cutting and rinsing or filtering apparatus for removing cutting powder by forming V-shaped grooves at the boundary of chips using anisotropic etchant and thereafter isolating chips by applying a stress to the V-shaped grooves. n CONSTITUTION: In a method of isolating chips from a wafer made of a single crystalline semiconductor material, after a V-shaped groove 3 is formed at the boundary of chips using anisotropic etchant, chips are isolated by giving a stress to such V-shaped grooves. For instance, in the case of isolating the silicon V-groove block for positioning and fixing an optical fiber by chip isolation from a silicon wafer 1, a first V-groove 2 for positioning and fixing an optical fiber in the <1,1,0> direction and a second V-groove 3 provided at the boundary of chips are formed by the anisotropic etching using hydrazine hydrate to the surface 1a of the silicon wafer 1 having the single crystalline (1, 0, 0) surface. The silicon wafer 1 is attached to a braking tape for the braking. n COPYRIGHT: (C)1992,JPO&Japio |
| priorityDate | 1990-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 15.