| abstract |
PURPOSE: To delay the sintering of metalizing paste, to adapt the contraction of the paste to that of glass ceramics, and to provide additive to the metalizing paste for promoting the adhesion of copper-based metallurgical materials to the glass ceramic. n CONSTITUTION: This is a method for promoting the adhesion of co-sintered copper-based metallurgical materials to a glass ceramic dielectric which includes a process for adding alloying metallic powders to the copper-based metallurgical materials before sintering. Also, metalizing paste indicating excellent adhesion to the glass ceramics contains an organic carrier, copper powder, and alloying metal, and this alloying metal is not non-copper metallic powders or copper- metallic alloy, but metal in the paste is preferably constituted of 80-99 weight% of copper and 1-20 weight% of alloying metal. n COPYRIGHT: (C)1992,JPO |