abstract |
PURPOSE: To improve efficiency of light acquiring of a GaP light emitting element chip and to remove processing damage (dicing distortion) well simultaneously. n CONSTITUTION: After a rough surface is formed by etching a surface of a GaP light emitting element chip by hydrochloric acid, it is etched by mixed solution consisting of sulfuric acid, hydrogen peroxide and water and is lastly etched by hydrochloric acid. n COPYRIGHT: (C)1992,JPO&Japio |