http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H04353849-A

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filingDate 1991-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8576ef90c83f005b508417794d178377
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publicationDate 1992-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H04353849-A
titleOfInvention Photosensitive resin composition and photosensitive element using that
abstract PURPOSE: To offer a photosensitive resin compsn. which gives a good resist shape, fine chips when peeled and excellent adhesion property to a base body and to offer a photosensitive element using this compsn. n CONSTITUTION: This resin compsn. consists of a mixture of vinyl copolymer compds. (A) having 50-120°C glass transition point, ethylene-type unsatd. compd. (B), and a sensitizer and/or sensitizer system (C) which can produce free radicals by active ray. The vinyl copolymer compds. are obtd. by copolymn. of methacrylic acid, methylmethacrylate, ethylacrylate and alkyl methacrylate having 2-12 carbon number in the alkyl part, and contain at least each one kind of 50000-2000000 weight mean mol.wt. copolymer compds.(a) and 10000-50000 weight mean mol.wt. copolymer compd.(b). n COPYRIGHT: (C)1992,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007286477-A
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Total number of triples: 27.