http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0434927-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38520f366e74704305b34fb93a81121e |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate | 1990-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e265a2679c8e8187a30c63b7121ff28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5332b9534758ffc9f4b3503a7acb2fa3 |
| publicationDate | 1992-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0434927-A |
| titleOfInvention | Pattern forming method for semiconductor device |
| abstract | PURPOSE: To eliminate use of an exposure unit and to smoothly form the sidewall of an opening by forming organic substance on a part not required for solvent in the formation of a pattern using solvent having hydrophobic properties for organic substance such as polyimide, etc., before coating with solvent. n CONSTITUTION: In the formation of a pattern of polyimide, an aluminum wiring pad 11, a passivation film (inorganic CVD film) 21, an opening 2, etc., are formed on a board 1. An adhesive tape made of a resin film 3 and an adhesive paste 31 is adhered on the entire surface. Then, it is peeled. The paste 31 remains only on the aluminum surface of the opening 2. Polyimide is dropped, spin coated from a dropping nozzle 4, and heat treated to be cured. A contraction of the film 5 and repellency on the paste 31 occur, and the film 5 remains only on the film 21. Then, the paste 31 is removed, for example, by O 2 plasma, etc. The opening 2 is exposed to complete the formation of a protective film of the polyimide. n COPYRIGHT: (C)1992,JPO&Japio |
| priorityDate | 1990-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804 |
Total number of triples: 17.