http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H04340551-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 |
| filingDate | 1991-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c01999fcbb60f8069c53c92af1a70a40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4ee9e177d9138a697451d413c4c9b34 |
| publicationDate | 1992-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H04340551-A |
| titleOfInvention | Photosensitive resin composition and laminated body using that |
| abstract | PURPOSE: To obtain a compsn. and a laminated body using this having a good resist pattern and the linearity and adhesion property of circuits after etching, with which such a problem that fine chips peeling from the body entangle to a feeder roll can be avoided, by incorporating a specified compd. into the compsn. n CONSTITUTION: The compsn. consists of a compd. expressed by formula I, an ethylenic unsatd. compd. having ≥100°C boiling point at normal pressure, a linear polymer compd. of 20000-300000 weight average mol.wt. having a carboxyl group, and a sensitizer and/or sensitizer group which can produce free radicals by active ray. The compsn. is soluble or swellable in an alkali aq. soln. In formula, R 1 and R 3 are independently hydrogen or methyl groups, and R 2 is a bivalent hydrocarbon having 3-10 carbon number. As necessary, dye, pigment, plasticizer, stabilizer, etc., may be added to this photosensitive resin compsn. This photosensitive resin compsn. can be applied on a supporting body and dried to be used as a photosensitive film. n COPYRIGHT: (C)1992,JPO&Japio |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008083090-A |
| priorityDate | 1991-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.