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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
filingDate 1991-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a252c2bad6781decf24f3274eb635154
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publicationDate 1992-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H04338691-A
titleOfInvention Manufacture of copper-plated laminated board
abstract PURPOSE: To manufacture a copper-plated laminated board having excellent reliability of heat resistance, long term electric insulation, and stable quality. n CONSTITUTION: A sheetlike base material is impregnated with resin composition in which 0.01-0.3 pts.wt. of imidazoles and 1 100 pts.wt. of normal chain polymer compound are mixed with 100 pts.wt. of total amount of polyepoxy compound (A) in which epichlorohydrin is reacted with condensate of phenol bromide and salicylaldehyde, special diaminotriazine (B), and polyphenol compound (C), a polycondensate of bisphenol A and formaldehyde. n COPYRIGHT: (C)1992,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6329474-B1
priorityDate 1991-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 33.