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filingDate 1991-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1992-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H04332754-A
titleOfInvention Electrical insulating resin paste
abstract PURPOSE: To provide a paste excellent in the workability in dispenser coating and small in its change with time, for use in semiconductor element bonding, comprising, as the essential components, a specific silica filler, epoxy resin liquid at normal temperatures and curing agent. n CONSTITUTION: The objective paste comprising, as the essential components, (A) an epoxy resin liquid at normal temperatures, (B) a curing agent, pref. a combination of a phenolic resin-based curing agent and a potential-type amine compound (e.g. dicyandiamide) and (C) a silica filler comprised of C1: fused and/or crushed silica powder 1-20μm in mean particle size and C 2 :10-50-wt.% of hydrophobic ultrafine silica power 2-50nm in the mean particle size of its primary particles with ≥50% of the silanol groups on its surface reacted with an organosilicon halogen compound of the formula (R is methyl, ethyl, butyl or octyl; X is Cl, Br, OCH 3 or OH; m+n=4) (e.g. dimethyldichlorosilane) or an alcohol. The component C accounts for 10-30wt.% of a total of the components A, B and C. n COPYRIGHT: (C)1992,JPO&Japio
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Total number of triples: 37.