http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H04324990-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4edd4e526605dbd18b513b4b30d19ab2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C17-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16 |
| filingDate | 1991-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_302f300ba6f37725d80d029611200853 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86c0c0104036cb7c5b6252e3156ec869 |
| publicationDate | 1992-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H04324990-A |
| titleOfInvention | Manufacture of hybrid integrated circuit |
| abstract | PURPOSE: To manufacture a hybrid integrated circuit without a dedicated and separated burning process where a printed resistor formed on a board is burned for a long time. n CONSTITUTION: Epoxy-modified multifunctional maleimide resin base carbon resin printing resistor paste is screen-printed between conductive paths 12 formed on a board 11, an overcoat film 16 is screen-printed on the printed resistor paste, and then the printed resistor paste is hardened a following process provided with a burning process which is carried out following a resistor printing process. n COPYRIGHT: (C)1992,JPO&Japio |
| priorityDate | 1991-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.