http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H04307937-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38520f366e74704305b34fb93a81121e |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate | 1991-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56d24296c7316904f109c18dd7d0f251 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6f1c7856f9f8d8d3e960b7809dbf341 |
| publicationDate | 1992-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H04307937-A |
| titleOfInvention | Manufacture of semiconductor element |
| abstract | PURPOSE: To obtain high bond strength without changing the conditions of wire bonding even when a polyimide resin, etc., are used as a protective film by providing a process, in which an organic group substance reattached onto a wafer is removed through etching during heat treatment for curing the polyimide resin, etc. n CONSTITUTION: The upper section of a semiconductor wafer, to which an element is formed, is coated with a polyimide resin or polyimide-isoindolo- quinazolidiode (PII) 6, and patterned. Heat treatment for curing said polyimide resin of PII 6 is executed, and an organic substance 8 reattached onto a wafer by the heat treatment is removed through etching. The organic substance 8 for example, reattached onto the whole surface of the wafer including a wiring pad 2 through an annealing process for film-curing the polyimide resin 6 is taken off through plasma ashing, etc., in a reaction system containing oxygen gas or wet etching by the etchant, etc., of a hydrazine group. n COPYRIGHT: (C)1992,JPO&Japio |
| priorityDate | 1991-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9321 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559527 |
Total number of triples: 14.