http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H04304695-A

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filingDate 1991-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb3579b4a1bea656257f8f7652a22b6c
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publicationDate 1992-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H04304695-A
titleOfInvention Manufacture of metal base wiring board
abstract PURPOSE: To provide a safe surface roughening processing of an insulation layer in a semi-additive process or a full-additive process. n CONSTITUTION: The surface of a metal base 2 is coated with epoxy resin, thereby forming an insulation layer 3. After the surface of the insulation layer 3 is subjected to roughening processing, using a hydrazine group solution, electroless copper plating is applied to the surface of the insulation layer 3 so as to form an electroless plating layer 4. As a surface roughening agent, a hydrazine group compound-containing solution is used, which covers hydrazine anyhydride, hydrazine hydrate, hydrazine hydrochloride, hydrobromic acid hydrazine, and hydrazine sulfate. n COPYRIGHT: (C)1992,JPO&Japio
priorityDate 1991-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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