http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0429319-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_01c1e0bc0628f76dea731cda5a666ca1
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-316
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
filingDate 1990-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b18eaf7d11e7eafcd11c5b51ecac0e10
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publicationDate 1992-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0429319-A
titleOfInvention Semiconductor element and its manufacture
abstract PURPOSE: To prevent shortcircuit between upper and lower wiring electrodes and generation of a leak due to penetration of water and to improve electromigration resistance by providing a plasma insulating film which is formed by plasma-treatment of a surface of an insulating film layer. n CONSTITUTION: Plasma insulating films 22, 26 are provided which are formed by performing plasma treatment for a surface of an insulating film layer 20. That is, a semiconductor element is formed performing plasma treatment for a surface of the insulating film layer 20 after the insulating film layer 20 is formed by plasma CVD method, sputtering method, vacuum deposition method, etc., to cover an electrode or a wiring. As the insulating film layer 20, an inorganic insulating material such as silicon, titanium, tantalum oxide, nitride, carbide or a mixture thereof can be used. Thereby, it is possible to prevent shortcircuit among upper electrode and lower electrode 14, 16, 18 of a matrix wiring and generation of a leak due to penetration of water and to improve electromigration resistance. n COPYRIGHT: (C)1992,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6048764-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7731338-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2006126536-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014524974-A
priorityDate 1990-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 26.