http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H04278594-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-04 |
| filingDate | 1991-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57667c0639bee6bc5c5e7892487597f5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f895a71e7f398046b1fc8a45def89d7 |
| publicationDate | 1992-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H04278594-A |
| titleOfInvention | Resin composition for flexible printed circuit board |
| abstract | PURPOSE: To improve heat resistance and to improve balance between an adhesive strength and a thermal expansion coefficient by forming of a polymer of special aromatic carboxylic acid dianhydride component and special aromatic diamine component. n CONSTITUTION: It is formed of a copolymer of aromatic carboxylic acid dianhydride component having 80:20-60:40 of molar ratio of biphenyltetracarboxylic acid dianhydride to benzophenone-tetracarboxylic dianhydride, and aromatic diamine component having 85:15-65:35 of molar ratio of p-phenylenediamine to 1,3-bis(3-aminophenoxy)benzene. The charge ratio of the acid dianhydride component to the diamine component is set to 0.90-1.10. Thus, heat resistance is improved, and balance between an adhesive strength and a thermal expansion coefficient can be improved. n COPYRIGHT: (C)1992,JPO&Japio |
| priorityDate | 1991-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.