http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H04223007-A

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filingDate 1990-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf3f6306909578c38d1c1e20eabfd721
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publicationDate 1992-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H04223007-A
titleOfInvention Conductive resin paste for semiconductor
abstract PURPOSE: To prevent change in viscosity and generation of gas by adding silver powder to an organic silicon halobun compound, or to hydrophobic super fine silica particles reacted with alcohol, in conductive resin paste for a semiconductor. n CONSTITUTION: Diglycidyl ether prepared by a reaction of flake-like silver powder having an average particle diameter of 3μm with bisphoenol A and epichlorohydrine, diluent glycylgylcidyl ether, a phenol novolak resin, dicyandiamide, and hydrophobic super fine particle silica powder having a primary particle of an average particle diameter of about 12nm and with about 70% of a silanol group formed on the surface thereof treated with dimethyldichlorosilane are blended and kneaded, thereby obtaining conductive paste. By using the resultant conductive paste for bonding a semiconductor element to a metal frame such as copper and a 42 alloy, a ceramic substrate, glass epoxy or the like, it is possible to enhance thioxotropya and prevent any cobwebbing. Therefore, workability can be improved without a secular change, thus reducing generation of bleeding and gas in hardening. n COPYRIGHT: (C)1992,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016088978-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7947779-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009203441-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003231865-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8119737-B2
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priorityDate 1990-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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