http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H04198483-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_086f7e73d7b41664750b79736f86b0d2
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-511
filingDate 1990-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3462e1949c49bfcf09cd71af66a5279
publicationDate 1992-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H04198483-A
titleOfInvention Thin film forming device
abstract PURPOSE: To easily form a homogeneous thin film having good quality on a large substrate by previously converting a part of a gaseous raw materials to plasma at the time of bringing the gaseous raw material into reaction by a plasma CVD method and forming the compd. thin film on the substrate. n CONSTITUTION: A substrate 23 to be treated and a nozzle 30 for discharging the gaseous raw materials are disposed in a vacuum chamber 21. Gaseous TiCl 4 as the main gaseous raw material and gaseous N 2 as an auxiliary gaseous raw material are supplied into the outside pipe 32 of the nozzle 30. The gaseous H 2 as an auxiliary gaseous raw material for reduction is supplied into the inside pipe 34. A glow discharge is generated by impressing a DC or AC bias voltage to the substrate 23 by a power source device 25 to contact the main gaseous raw material and the auxiliary gaseous raw material into the plasma and to bring these gaseous raw materials into reaction, by which the thin film of TiN is formed on the substrate 23. The gaseous H 2 of the auxiliary gaseous raw material is previously converted to the plasma by a plasma forming means 25 and the plasma is supplied into the nozzle 30, by which the gaseous pressure in the nozzle 30 is set higher than the gaseous pressure in the chamber and the amt. of the byproduct impurities, such as TiCl 3 , generated at the time of the reduction by the H 2 of the TiCl 4 is suppressed. The thin film of the high-purity TiN is thus stably formed on the substrate. n COPYRIGHT: (C)1992,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014535001-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-1308483-C
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6960262-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008115412-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8092600-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007217749-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03106730-A1
priorityDate 1990-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5352426

Total number of triples: 22.