| abstract |
PURPOSE: To obtain the title polyamide gibing a polybenzoxazole excellent in heat resistance, water absorption properties, dielectric characteristics, etc., by subjecting specific raw materials to condensation by dehydration using dicycloexylcarbodiimide. n CONSTITUTION: The title polyamide, having repeating units of formula I (wherein X is group of formula II, III or IV; Y is a group of formula V, VI, VII, VIII, or IX; a is 0.1-1; b is 0.9-0; and a+b is 1) and a reduced viscosity measured in N-methylpoyrrolidone at 25°C of 0.05-0.5, is obtained by subjecting raw materials, such as a carboxylic acid and a diamine, to condensation by dehydration using dicyclohexylcarbodiimide. A varnish prepd. by dissolving the polyamide in a solvent is suitably used for forming a protective or insulating film for an electronic material like a semiconductor. n COPYRIGHT: (C)1992,JPO&Japio |