http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H04170044-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e80d21c729aa6ff53bc0452132800c04
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
filingDate 1990-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3de16dd5e4418b2e1f6975884fe558ae
publicationDate 1992-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H04170044-A
titleOfInvention Jig for inspecting semiconductor wafer
abstract PURPOSE: To eliminate the defect of scratching the plane of the pad which is caused by bringing a probe into contact with a pad with load on the pad by providing a flat-plane contact which makes contact with the projecting electrodes of a semiconductor device. n CONSTITUTION: The jig is provided with an electrode 7 which makes contact with a bump-shaped electrode 5 projecting from the top plane of a semiconductor wafer 1 at the flat plane. Namely, the jig is provided with an opening whose size is accorded with that of a semiconductor device having a glass epoxy substrate 6 as a supporting substrate, and under a polyimide film 8, a print pattern 7, which becomes the contact and the wiring to a bump pad 5, is provided, and the drawn out print pattern 7 is connected with wiring 11 which is connected with a measuring device on the substrate 6. A relatively hard transparent supporting polyimide film 10 supports a transparent vinyl chloride block 9 which becomes a cushion for attaining uniform contact with a plurality of electrodes with small load. Thus, the excellent electric connection is attained without destroying the bump-shaped electrodes. n COPYRIGHT: (C)1992,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07263501-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0712890-A
priorityDate 1990-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6338
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID407874179

Total number of triples: 15.