| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49883 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
1990-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86b4c4a58b3bd6d113037e31a1e76fa7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97bed56bb065fbf29f8cf5cd78667951
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94ce65e39665d196b09afb349777775c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15ad10314807fcd4345a7968a79a821f |
| publicationDate |
1992-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H04169002-A |
| titleOfInvention |
Conductive paste and manufacture of multilayer ceramic wiring substrate using it |
| abstract |
PURPOSE:To realize wire bonding with good reliability by adding at least a solvent and an organic binder to a specific inorganic component. CONSTITUTION:A copper multilayer ceramic substrate 2 is made up by adding at least a solvent and an organic binder to a green sheet made up of glass- ceramics mixed powder, and an inorganic component containing at least one or more kinds of Ni powder, Pt powder and Pb powder whose average grain size is 10mum or less at 0.5-10.0wt.% in au powder whose grain size is 10mum or less at 90.0-97.5wt.%. In this case, Au 7 can be formed on the upper layer portion of the multilayer substrate 2, so that wire bonding with good reliability can be realized. It is thereby possible to form Au wiring 7 necessary for wire bonding and flip chip mounting with good matching property to ceramic material and also reliability. |
| priorityDate |
1990-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |