| abstract |
PURPOSE: To provide the resin composition having a high glass transition point, excellent moisture resistance and compatibility and excellent low stress characteristics and useful for sealing semiconductors by compounding a specific propargyl etherified resin, a polysiloxane and a maleimide resin. n CONSTITUTION: The resin composition comprises (A) 100 pts.wt. of a propargyl etherified resin of formula I (R 1 is H, CH 3 ; 0<a<100; 0<b,c<100 and a+b+c=100) and/or a propargyl etherified resin of formula II (0<d<100, 0≤e,f<100 and d+e+f=100), 2-100 pts.wt. of a polysiloxane of formula III (X is H, group of formula IV, group of formula V, CH=CH 2 , CH 2 -CH=CH 2 ; R 2 is CH 3 , phenyl, X; n=1-100) and (C) 2-200 pts.wt., preferably 20-150 pts.wt., of a maleimide resin (e.g. N,N'-m-phenylenebismaleimide). n COPYRIGHT: (C)1992,JPO&Japio |