| abstract |
PURPOSE: To provide a thermosetting resin composition having good workability and curability, excellent heat resistance, moisture resistance and toughness and low dielectric constant and useful for laminate boards by compounding a specific propargyl etherified phenol.aromatic hydrocarbon resin, a maleimide resin, etc. n CONSTITUTION: The thermosetting composition comprises (A) 100 pts.wt. of a propargyl etherified phenol.aromatic hydrocarbon resin of formula I (R 1 , R 2 are -H, -CH 3 ; 0<a,b,c<100 and a+b+c=100) and/or propargyl etherified hydroxystyrene.styrene copolymer and(B) 2-200 pts.wt., preferably 20-150 pts.wt., of a maleimide resin (e.g. N,N'-m-phenylenebismaleimide). n COPYRIGHT: (C)1992,JPO&Japio |