| abstract |
A semiconductor device (10) including a metallurgically compatible unplated package. The package includes a plateless copper alloy die mount area (14) to which a semiconductor die (12) is attached. The semiconductor die (12) is metallized on its mounting surface (40) to provide electrical contact. A metallic solder (38) which is compatible with both the copper alloy and the die metallization joins the die (12) to the die mount area (14). The package further includes a plateless copper alloy lead portion (16) which is physically joined (42) to the die mount area (14). The top surface of the semiconductor die (12) is provided with a patterned metallization (24, 26) making electrical contact to select the portions of the die. Electrical contact is made between the top surface die metallization (24, 26) and the lead portion (16) of the package by ultrasonically bonded copper ribbon (28). The die (12) and interconnecting ribbon (28) is then enclosed by an epoxy encapsulant (18) or by a welded metal cover (58). |