http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H04120123-A

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filingDate 1990-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f0329b788258dca37623b3d5be5eb119
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publicationDate 1992-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H04120123-A
titleOfInvention Production of epoxy resin having high molecular weight
abstract PURPOSE: To obtain the subject resin useful as an adhesive, insulation material, paint, molded article, film, etc., by polymerizing a bifunctional epoxy resin and a bifunctional phenolic compound at a specific ratio in the presence of an aliphatic cyclic amine catalyst under heating in a polymerization reaction solvent. n CONSTITUTION: The objective resin can be produced by polymerizing a bifunctional epoxy resin (e.g. bisphenol A epoxy resin) and a bifunctional phenolic compound (e.g. hydroquinone) at a ratio of 1:(0.9-1.1) in the presence of an aliphatic cyclic amine catalyst (preferably 1,4-diazabicyclo[2.2.2]octane, 1,5- diazabicyclo[4.3.0]-5-nonane or 1,8-diazabicyclo[5.4.0]-7-undecene) in a polymerization reaction solvent under heating preferably at ≤130°C. n COPYRIGHT: (C)1992,JPO&Japio
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