| abstract |
PURPOSE: To increase wetting properties and reactivity between copper paste and aluminum nitride substrate and to improve adhesivity between conductive material and substrate by blending copper powder with lead borate glass, cuprous oxide, organic binder and high-boiling solvent. n CONSTITUTION: This copper paste is obtained by blending 100 pts.wt. copper powder having 0.1-5.0μm particle diameter with 2-20 pts.wt. lead borate glass, 5-10 pts.wt. cuprous oxide, an organic binder and a high-boiling solvent. Ethyl cellulose, acrylic resin, etc., may be used as the organic binder and terpineol, dibutyl phthalate, etc., as the high-boiling solvent. The copper paste obtained by the above-mentioned blending is applied to an aluminum nitride substrate, the aluminum nitride substrate is calcined in a nitrogen atmosphere to metallize the aluminum nitride substrate. n COPYRIGHT: (C)1991,JPO&Japio |