http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0388846-A

Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-224
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01F41-02
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filingDate 1990-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a918ec407efe4d15b0e11981b7869846
publicationDate 1991-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0388846-A
titleOfInvention Composition for infrared reflow and electronic part
abstract PURPOSE: To obtain a compound suitable for electronic parts for infrared reflow, having excellent heat resistance, consisting essentially of a polyamide comprising a specific dicarboxylic acid component unit and a specific diamine component unit. n CONSTITUTION: (A) 100 pts. wt. polyamide comprising a dicarboxylic acid composed of a repeating unit consisting of 30-100mol % terephthalic acid component unit and 0-40mol% aromatic dicarboxylic acid component unit except terephthalic acid and/or 0-70mol% aliphatic dicarboxylic acid component unit and a diamine component composed of a repeating unit consisting of an aliphatic alkylenediamine component unit and/or an alicyclic alkylenediamine component unit, having 0.5-3dl/g intrinsic viscosity and 280-340°C melting point is blended with (B) ≤200 pts.wt., preferably 5-150 pts.wt. glass fibers. n COPYRIGHT: (C)1991,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8940834-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1888679-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10072137-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1888667-A2
priorityDate 1989-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 26.