http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0378748-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031
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filingDate 1989-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a775279f0c73ed34c5dfc3ea631f431f
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publicationDate 1991-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0378748-A
titleOfInvention Photosensitive resin composition
abstract PURPOSE: To obtain superior heat resistance, a low modulus of elasticity and high adhesion by using a specified sensitizer having high photosensitivity and a specified initiator in combination. n CONSTITUTION: A photosensitive resin compsn. essentially contg. polyamic acid copolymerized with 1-50 wt.% silicone diamine represented by formula I, a multifunctional acrylate having two or more acrylic or methacrylic groups in one molecule and ≤500 mol.wt. as a photosensitive agent, a styryl compd. represented by formula II as a sensitizer and a glycine compd. represented by formula III as an initiator is used. The amt. of the photosensitive agent blended is 20-200 pts.wt. per 100 pts.wt. of the polyamic acid, that of the sensitiz er is 1-10 pts.wt. and that of the initiator is 1-20 pts.wt. Thus adhesion is im proved, and high sensitivity, photosetting property and heat resistance of a coating film after setting are obtd. in spite of reducing the modulus of elasticity. n COPYRIGHT: (C)1991,JPO&Japio
priorityDate 1989-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 23.