http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H03738-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-452 |
filingDate | 1989-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0f3d7d4925f948764025849a1a81023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81552b5005a27c78043295776ead13e5 |
publicationDate | 1991-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-H03738-A |
titleOfInvention | Sealing resin |
abstract | PURPOSE: To provide a resin for sealing a semiconductor with good storage stability, excellent low stress characteristics and moisture resistance, high glass transition pt. and excellent reliability after immersion in solder by reacting a bismaleimide with a specified amine-modified polysiloxane. n CONSTITUTION: A reaction product of 100 pts.wt. bismaleimide of formula I (wherein R is a divalent arom. group) (e.g. N,N,4,4'- diphenylmethanebismaleimide) with 10-120 pts.wt. amine-modified polysiloxane (obtd. by reacting an arom. polyamine, e.g. 4,4'-diamonodiphenylmethane, with a compd. of formula II (wherein R 2 is an alkylene or a phenylene; R 3 and R 4 are each an alkyl or a phenyl; n is 1-100) at a ratio of the amino group to the glycidyl group of 1.2-10) is used as a sealing resin. n COPYRIGHT: (C)1991,JPO&Japio |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20010085184-A |
priorityDate | 1989-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.