http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0373590-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6ec98db0102cc54087022bd58b0e6799 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| filingDate | 1989-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_445206fae7155604cc944db29cd1a1aa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d31c576b1009657687527745a996412c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4aaeaa5f3a3ec1c3dde2ad2e6f5f6d7 |
| publicationDate | 1991-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0373590-A |
| titleOfInvention | Manufacture of printed board |
| abstract | PURPOSE: To form a photoresistive resist film uniform in thickness on the whole surface of a base material by cutting the peripheral edge of the material to be considered that plating solution is immersed at the time of plating a panel, and then forming a photosensitive resist film by an electrodepositing coating method. n CONSTITUTION: After a base material 1 is degreased, washed with hot water, conditioned by a conditioner, subjected to soft etching, predipped, catalyzed, accelerated by an accelerator, subjected to electroless plating, degreased, subjected to soft etching, activated with sulfuric acid, and subjected to panel plating by use of copper sulfate plating on the surface to form a copper layer. As shown by broken lines, the peripheral edges 1a-1d of the material 1 are cut in width of about 1cm, its material 1' is dipped in an electrodepositing tank to be electrodeposited. Then, after it is dried, it is matched with a mask, exposed with an ultraviolet ray, and the electrodeposited film except a part to become resist is removed with caustic soda. Thereafter, a plated part except a pattern is removed with predetermined etchant, and a circuit is then formed. A uniform and fine pattern is obtained on the whole surface. n COPYRIGHT: (C)1991,JPO&Japio |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4704233-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8132024-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8993670-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006279935-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7759418-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009110480-A1 |
| priorityDate | 1989-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.