http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0344646-A

Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
filingDate 1989-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5333a0ccedf0eb7b6b74f0e3e673145
publicationDate 1991-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0344646-A
titleOfInvention Formation of resist pattern
abstract PURPOSE: To improve subsurface treating and line width controlling properties by treating the deposits on side walls generated at the time of dry development of a photoresist with plasma contg. fluorine or acidic soln. n CONSTITUTION: The prescribed parts of the photoresist film 3 are exposed via a mask pattern 17 by a UV beam 16 to form exposed parts 4a. Silicon is then selectively diffused into the exposed parts 4a in a gas contg. silicon in the molecule of hexamethyl disilazane, etc. The resist film is thereafter subjected to a dry development by O 2 plasma to remove the exposed parts. The deposits of 200 to 400Å are formed on the side walls of the resist film 6 in this state and, therefore, the resist film is immersed into an aq. soln. mixture composed of 90% ammonium fluoride and 40% acetic acid to remove the deposits in succession to the above-mentioned development. The controllability of the line width transferred on the subsurface side walls and the reproducibility of the subsurface working are improved in this way. n COPYRIGHT: (C)1991,JPO&Japio
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7521373-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8632692-B2
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priorityDate 1989-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 31.